llm-kg-bench-results_2023-07-03_12-40-34_FactExtract-claude-20x.json

[
  {
    "startTime": "2023-07-03T12:40:34.817296",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
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      "parsableTriples": "_:n7c9545667b9f41f4899e621e93501f62b2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit/Millimeter> .\n_:n7c9545667b9f41f4899e621e93501f62b1 <http://qudt.org/schema/qudt#quantityValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/industry_f340> <http://schema.org/width> _:n7c9545667b9f41f4899e621e93501f62b1 .\n_:n7c9545667b9f41f4899e621e93501f62b3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit/Millimeter> .\n<https://data.semper-ki.org/resources/industry_f340> <http://schema.org/depth> _:n7c9545667b9f41f4899e621e93501f62b3 .\n<https://data.semper-ki.org/resources/industry_f340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:n7c9545667b9f41f4899e621e93501f62b2 <http://qudt.org/schema/qudt#quantityValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n7c9545667b9f41f4899e621e93501f62b1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit/Millimeter> .\n<https://data.semper-ki.org/resources/industry_f340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3dgence> .\n_:n7c9545667b9f41f4899e621e93501f62b3 <http://qudt.org/schema/qudt#quantityValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/industry_f340> <http://schema.org/height> _:n7c9545667b9f41f4899e621e93501f62b2 .\n"
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      [
        "prompt",
        "2023-07-03T12:40:34.817302",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:40:46.532482",
        " @prefix printer: <https://data.semper-ki.org/resources/> .\n@prefix schema: <http://schema.org/> .\n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix qudt: <http://qudt.org/schema/qudt#> . \n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix tema: <https://purl.org/tema/> .  \n\nprinter:industry_f340 rdf:type tema:051993 ; \n                    schema:manufacturer printer:3dgence ;   \n                    https://data.semper-ki.org/properties/printMaterial  \n                                        printer:materials:abs,\n                                        printer:materials:asa,\n                                        printer:materials:pa,\n                                        printer:materials:pa_cf,\n                                        printer:materials:pa_gf,\n                                        printer:materials:pc,\n                                        printer:materials:pc_abs,\n                                        printer:materials:pc_esd,\n                                        printer:materials:pc_cf,\n                                        printer:materials:peek, \n                                                        printer:materials:pekk,\n                                                        printer:materials:pla, \n                                                        printer:materials:pp,\n                                                        printer:materials:tpu,\n                                                        printer:materials:pet ;    \n                    https://data.semper-ki.org/properties/supportMaterial  \n                                                printer:materials:abs,    \n                                                printer:materials:bvo,\n                                                printer:materials:esm-10,\n                                                printer:materials:hips ;          \n                    schema:width [qudt:quantityValue \"1200\"^^xsd:double;  \n                                             qudt:hasUnit <http://qudt.org/vocab/unit/Millimeter> ] ;          \n                    schema:height [qudt:quantityValue \"800\"^^xsd:double;  \n                                           qudt:hasUnit <http://qudt.org/vocab/unit/Millimeter> ] ;   \n                    schema:depth [qudt:quantityValue \"1100\"^^xsd:double;  \n                                           qudt:hasUnit <http://qudt.org/vocab/unit/Millimeter> ] .  "
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:40:47.071254",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
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    "duration": "0:00:14.022540",
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      [
        "prompt",
        "2023-07-03T12:40:47.071260",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:41:01.093794",
        " @base <https://data.semper-ki.org/resources/Industry_F340> a <https://purl.org/tema/051993> ; \n        <https://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> ;\n        <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> , \n                <https://data.semper-ki.org/resources/materials/ASA> , \n                <https://data.semper-ki.org/resources/materials/HIPS> ,\n                <https://data.semper-ki.org/resources/materials/PA> ,  \n                <https://data.semper-ki.org/resources/materials/PA_CF> , \n                <https://data.semper-ki.org/resources/materials/PA_GF> , \n                <https://data.semper-ki.org/resources/materials/PC> ,\n                <https://data.semper-ki.org/resources/materials/PC_ABS> ,  \n                <https://data.semper-ki.org/resources/materials/PC_CF> ,   \n                <https://data.semper-ki.org/resources/materials/PC_ESD> ,     \n                <https://data.semper-ki.org/resources/materials/PEEK> ,\n                <https://data.semper-ki.org/resources/materials/PEKK> ,    \n                <https://data.semper-ki.org/resources/materials/PLA> , \n                <https://data.semper-ki.org/resources/materials/PP> ,  \n                <https://data.semper-ki.org/resources/materials/TPU> ;\n        <https://data.semper-ki.org/properties/supportMaterial>  <https://data.semper-ki.org/resources/materials/ABS> , \n                <https://data.semper-ki.org/resources/materials/ESM-10> , \n                <https://data.semper-ki.org/resources/materials/HIPS> , \n                <https://data.semper-ki.org/resources/materials/BVOH> ;\n        <https://schema.org/width> [qudt:numericValue \"265.0\"^^xsd:double ;\n                                    qudt:hasUnit <https://qudt.org/vocab/unit/ Millimeter>] ; \n        <https://schema.org/depth>  [qudt:numericValue \"300.0\"^^xsd:double ; \n                                     qudt:hasUnit  <https://qudt.org/vocab/unit/Millimeter>] ;\n        <https://schema.org/height> [qudt:numericValue \"340.0\"^^xsd:double ;\n                                     qudt:hasUnit <https://qudt.org/vocab/unit/Millimeter>] .\n\n<https://data.semper-ki.org/resources/3DGence> rdfs:label \"3DGence\" ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:41:01.496098",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
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      [
        "prompt",
        "2023-07-03T12:41:01.496103",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:41:10.112204",
        " @prefix 3dg: <https://data.semper-ki.org/resources/> .\n@prefix mat: <https://data.semper-ki.org/resources/materials/> .\n@prefix qudt: <http://qudt.org/1.1/schema/qudt#> . \n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix sdo: <https://schema.org/> .\n@prefix tema: <https://purl.org/tema/> .\n\n3dg:Industry_F340 \n    rdf:type tema:051993;\n    sdo:manufacturer 3dg:3DGence;\n    sdo:printMaterial mat:ABS, mat:PLA, mat:PA, mat:ASA, mat:PP, mat:TPU;\n    sdo:supportMaterial mat:ESM-10, mat:HIPS, mat:BVOH;\n    sdo:width [qudt:numericValue \"260.0\"^^xsd:double; qudt:hasUnit qudt:Millimeter];\n    sdo:depth  [qudt:numericValue \"300.0\"^^xsd:double; qudt:hasUnit qudt:Millimeter];\n    sdo:height [qudt:numericValue \"340.0\"^^xsd:double; qudt:hasUnit qudt:Millimeter].\n\n3dg:3DGence rdfs:label \"3DGence\"@en.  "
      ]
    ]
  },
  {
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    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
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    "info": {
      "parsableTriplesCount": 17,
      "parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PEEK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PC-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/0519933DPrinter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PC> .\n"
    },
    "duration": "0:00:09.191682",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:41:10.281405",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:41:19.473082",
        " @prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix schema: <http://schema.org/> .\n@prefix tema: <https://purl.org/tema/051993> .\n@prefix : <https://data.semper-ki.org/resources/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix unit: <http://qudt.org/vocab/unit#> .\n\n\n:Industry_F340 rdf:type tema:3DPrinter .\n:Industry_F340 schema:manufacturer :3DGence . \n:3DGence  rdfs:label \"3DGence\" .\n\n:Industry_F340 :printMaterial  :ABS , :PLA , :PA , :ASA , :PP , :TPU , :PC , :PC-ABS , :PC-ESD , :PC-CF , :PEEK , :PEKK .\n:Industry_F340 :supportMaterial  :ESM-10 , :HIPS , :BVOH .\n\n:Industry_F340 schema:width [qudt:numericValue \"260.0\"^^xsd:double; qudt:hasUnit unit:MILLIMETER] .\n:Industry_F340 schema:depth  [qudt:numericValue \"300.0\"^^xsd:double; qudt:hasUnit unit:MILLIMETER] .\n:Industry_F340 schema:height [qudt:numericValue \"340.0\"^^xsd:double; qudt:hasUnit unit:MILLIMETER] ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:41:19.646860",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.2436940602115541,
      "normDiffRatio": 0.7832187070151306,
      "norm_precision": 0.8636363636363636,
      "norm_recall": 0.6551724137931034,
      "norm_f-measure": 0.7450980392156864,
      "printMat_precision": 0.9230769230769231,
      "printMat_recall": 0.9230769230769231,
      "printMat_f-measure": 0.9230769230769231,
      "supportMat_precision": 1.0,
      "supportMat_recall": 1.0,
      "supportMat_f-measure": 1.0,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.65625
    },
    "info": {
      "parsableTriplesCount": 21,
      "parsableTriples": "<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/modelVersion> \"REV 1/2020\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-GF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://eunis.org/thesaurus/tema#051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n"
    },
    "duration": "0:00:17.899843",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:41:19.646865",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:41:37.546703",
        " Here is the RDF Knowledge Graph in turtle serialization:\n\n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#>.\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#>.\n@prefix tema: <http://eunis.org/thesaurus/tema#>.\n@prefix schema: <http://schema.org/>.\n@prefix qudt: <http://qudt.org/1.1/schema/qudt#>.\n\n<https://data.semper-ki.org/resources/Industry_F340> rdf:type tema:051993.\n<https://data.semper-ki.org/resources/Industry_F340> schema:manufacturer <https://data.semper-ki.org/resources/3DGence> ;\n\t\t\t\t\t\t\t\t\t schema:modelVersion \"REV 1/2020\" . \n<https://data.semper-ki.org/resources/3DGence> rdfs:label \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340>   <https://data.semper-ki.org/properties/printMaterial> \t <https://data.semper-ki.org/resources/materials/ABS>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/ASA>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/PA>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/PA-CF>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/PA-GF>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/PLA>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/PP>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/PC>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/PC-ABS>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/PC-CF>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/PEEK>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/PEKK>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340>   <https://data.semper-ki.org/properties/supportMaterial>\t\t<https://data.semper-ki.org/resources/materials/ABS>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/ESM-10>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/HIPS>,\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<https://data.semper-ki.org/resources/materials/BVOH>.\n<https://data.semper-ki.org/resources/Industry_F340>   schema:width [qudt:numericValue \"260.0\"^^xsd:double ;\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\tqudt:hasUnit <http://qudt.org/vocab/unit/M> ].\n<https://data.semper-ki.org/resources/Industry_F340>  schema:depth  [qudt:numericValue  \"300.0\"^^xsd:double ;\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t qudt:hasUnit <http://qudt.org/vocab/unit/M> ].  \n<https://data.semper-ki.org/resources/Industry_F340>   schema:height [qudt:numericValue \"340.0\"^^xsd:double ;\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\tqudt:hasUnit <http://qudt.org/vocab/unit/M> ]."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:41:37.841624",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.30450928381962866,
      "normDiffRatio": 0.0,
      "norm_precision": 1.0,
      "norm_recall": 0.0,
      "norm_f-measure": 0.0,
      "printMat_precision": 1.0,
      "printMat_recall": 0.0,
      "printMat_f-measure": 0.0,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.0,
      "supportMat_f-measure": 0.0,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.0
    },
    "info": {
      "parsableTriplesCount": 0,
      "parsableTriples": ""
    },
    "duration": "0:00:11.971124",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:41:37.841629",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:41:49.812748",
        " @prefix https: <https://data.semper-ki.org/resources/> .\n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n\n\nhttps://data.semper-ki.org/resources/Industry_F340 rdf:type https://purl.org/tema/051993 ;\nschema:manufacturer https://data.semper-ki.org/resources/3DGence ; \nhttps://data.semper-ki.org/properties/printMaterial https://data.semper-ki.org/resources/materials/ABS, https://data.semper-ki.org/resources/materials/PLA,  \nhttps://data.semper-ki.org/resources/materials/PA, https://data.semper-ki.org/resources/materials/ASA,\nhttps://data.semper-ki.org/resources/materials/PP, https://data.semper-ki.org/resources/materials/TPU ; \nhttps://data.semper-ki.org/properties/supportMaterial  https://data.semper-ki.org/resources/materials/ESM-10,\nhttps://data.semper-ki.org/resources/materials/HIPS, https://data.semper-ki.org/resources/materials/BVOH  ;\nschema:height [qudt:numericValue \"340.0\"^^xsd:double; qudt:hasUnit https://qudt.org/vocab/unit/M#meter] ;\nschema:width [qudt:numericValue \"300.0\"^^xsd:double; qudt:hasUnit https://qudt.org/vocab/unit/M#meter] ; \nschema:depth  [qudt:numericValue \"260.0\"^^xsd:double; qudt:hasUnit https://qudt.org/vocab/unit/M#meter] .\n\nhttps://data.semper-ki.org/resources/3DGence rdfs:label \"3DGence\" ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:41:50.025682",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.3484757919904363,
      "normDiffRatio": 0.3403494837172359,
      "norm_precision": 0.6,
      "norm_recall": 0.20689655172413793,
      "norm_f-measure": 0.3076923076923077,
      "printMat_precision": 1.0,
      "printMat_recall": 0.0,
      "printMat_f-measure": 0.0,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.0,
      "supportMat_f-measure": 0.0,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.34375
    },
    "info": {
      "parsableTriplesCount": 11,
      "parsableTriples": "_:na84af986f9b54a81b82959e9055da852b3 <http://qudt.org/1.1/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Meter> .\n_:na84af986f9b54a81b82959e9055da852b2 <http://qudt.org/1.1/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Meter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:na84af986f9b54a81b82959e9055da852b2 <http://qudt.org/1.1/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:na84af986f9b54a81b82959e9055da852b2 .\n_:na84af986f9b54a81b82959e9055da852b3 <http://qudt.org/1.1/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:na84af986f9b54a81b82959e9055da852b1 <http://qudt.org/1.1/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:na84af986f9b54a81b82959e9055da852b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:na84af986f9b54a81b82959e9055da852b3 .\n_:na84af986f9b54a81b82959e9055da852b1 <http://qudt.org/1.1/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Meter> .\n"
    },
    "duration": "0:00:09.633340",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:41:50.025687",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:41:59.659022",
        " @prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#>.\n@prefix schema: <http://schema.org/>.\n@prefix qudt: <http://qudt.org/1.1/schema/qudt#>. \n@prefix tema: <https://purl.org/tema/> .\n@prefix 3dp: <https://data.semper-ki.org/properties/> .\n@prefix mat: <https://data.semper-ki.org/resources/materials/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#>.\n\n<https://data.semper-ki.org/resources/Industry_F340> rdf:type tema:051993;\nschema:manufacturer <https://data.semper-ki.org/resources/3DGence> ; \n3dp:printMaterial mat:ABS, mat:PLA, mat:PA, mat:ASA, mat:PP, mat:TPU ; \n3dp:supportMaterial mat:ESM-10, mat:HIPS, mat:BVOH ;\nschema:width [qudt:numericValue \"260.0\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Meter> ] ;\nschema:height [qudt:numericValue \"300.0\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Meter> ] ;\nschema:depth [qudt:numericValue \"340.0\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Meter> ] .\n\n<https://data.semper-ki.org/resources/3DGence> rdfs:label \"3DGence\" ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:41:59.769088",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.26352813852813856,
      "normDiffRatio": 0.9039636127355426,
      "norm_precision": 0.5925925925925926,
      "norm_recall": 0.5517241379310345,
      "norm_f-measure": 0.5714285714285714,
      "printMat_precision": 0.7272727272727273,
      "printMat_recall": 0.6153846153846154,
      "printMat_f-measure": 0.6666666666666667,
      "supportMat_precision": 0.75,
      "supportMat_recall": 0.75,
      "supportMat_f-measure": 0.75,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.84375
    },
    "info": {
      "parsableTriplesCount": 27,
      "parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM_10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n86df48765ea74569889a86eb1ef0c215b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n86df48765ea74569889a86eb1ef0c215b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC_CF> .\n_:n86df48765ea74569889a86eb1ef0c215b1 <http://qudt.org/schema/qudtnumericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC_ESD> .\n_:n86df48765ea74569889a86eb1ef0c215b3 <http://qudt.org/schema/qudtnumericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n86df48765ea74569889a86eb1ef0c215b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n_:n86df48765ea74569889a86eb1ef0c215b1 <http://qudt.org/schema/qudthasUnit> <https://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/0519933D_Printer> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n_:n86df48765ea74569889a86eb1ef0c215b2 <http://qudt.org/schema/qudthasUnit> <https://qudt.org/vocab/unit#MMillimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC_ABS> .\n_:n86df48765ea74569889a86eb1ef0c215b2 <http://qudt.org/schema/qudtnumericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n86df48765ea74569889a86eb1ef0c215b3 <http://qudt.org/schema/qudthasUnit> <https://qudt.org/vocab/unit#MMillimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n"
    },
    "duration": "0:00:12.384170",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:41:59.769093",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:42:12.153258",
        " @prefix rdfs:  <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd:  <http://www.w3.org/2001/XMLSchema#> .\n@prefix tema: <https://purl.org/tema/051993> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt> .\n@prefix mat: <https://data.semper-ki.org/resources/materials/> .\n@prefix data: <https://data.semper-ki.org/resources/> .  \n@prefix prop: <https://data.semper-ki.org/properties/> .\n\ndata:Industry_F340 a tema:3D_Printer;\n   schema:manufacturer data:3DGence;\n\tprop:printMaterial mat:ABS ;\n\tprop:printMaterial mat:PLA;\n\tprop:printMaterial mat:ASA   ;\n\tprop:printMaterial mat:PP ;\n\tprop:printMaterial mat:TPU ; \n\tprop:printMaterial mat:PC ;\n  prop:printMaterial mat:PC_ABS;\n   prop:printMaterial mat:PC_ESD ;\n   prop:printMaterial mat:PC_CF ; \n   prop:printMaterial mat:PEEK ;  \n   prop:printMaterial mat:PEKK;\n   prop:supportMaterial mat:ESM_10 ;\n   prop:supportMaterial mat:HIPS;\n   prop:supportMaterial mat:BVOH;\n   prop:supportMaterial mat:ABS;\n\tschema:width [qudt:numericValue \"1200.0\"^^xsd:double; qudt:hasUnit <https://qudt.org/vocab/unit#Millimeter> ]; \n\tschema:height [qudt:numericValue \"800.0\"^^xsd:double; qudt:hasUnit <https://qudt.org/vocab/unit#MMillimeter> ];\n   schema:depth [qudt:numericValue \"1100.0\"^^xsd:double; qudt:hasUnit <https://qudt.org/vocab/unit#MMillimeter> ];\n\ndata:3DGence\n\trdfs:label \"3DGence\";\n    ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:42:12.270598",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
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      "printMat_recall": 0.0,
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      "supportMat_recall": 0.0,
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      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
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      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.0
    },
    "info": {
      "parsableTriplesCount": 0,
      "parsableTriples": ""
    },
    "duration": "0:00:12.148927",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:42:12.270603",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:42:24.419525",
        " @prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix schema: <http://schema.org/> .\n@prefix https://data.semper-ki.org/resources/: <https://data.semper-ki.org/resources/> .\n@prefix https://data.semper-ki.org/properties/: <https://data.semper-ki.org/properties/> .   \n@prefix https://data.semper-ki.org/resources/materials/: <https://data.semper-ki.org/resources/materials/> . \n\nhttps://data.semper-ki.org/resources/Industry_F340\n        rdf:type     https://tema.example.com/051993 ;\n        schema:manufacturer https://data.semper-ki.org/resources/3DGence ;\n        https://data.semper-ki.org/properties/printMaterial  https://data.semper-ki.org/resources/materials/ABS,\n                                                    https://data.semper-ki.org/resources/materials/PLA ,\n                                                    https://data.semper-ki.org/resources/materials/PA,\n                                                    https://data.semper-ki.org/resources/materials/ASA,\n                                                    https://data.semper-ki.org/resources/materials/PP,\n                                                    https://data.semper-ki.org/resources/materials/TPU ;\n        https://data.semper-ki.org/properties/supportMaterial  \n                                                    https://data.semper-ki.org/resources/materials/ESM-10 ,\n                                                    https://data.semper-ki.org/resources/materials/BVOH,\n                                                    https://data.semper-ki.org/resources/materials/HIPS  ;\n        schema:width [qudt:numericValue \"260\"^^xsd:double; qudt:hasUnit qudt:millimeter],\n        schema:depth [qudt:numericValue \"300\"^^xsd:double; qudt:hasUnit qudt:millimeter],\n        schema:height [qudt:numericValue \"340\"^^xsd:double;qudt:hasUnit qudt:millimeter] .\n\n3DGence\n        rdf:type    rdfs:label ;\n        rdfs:label \"3DGence\" ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:42:24.688871",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.21544327931363202,
      "normDiffRatio": 0.1479580927945264,
      "norm_precision": 0.14285714285714285,
      "norm_recall": 0.034482758620689655,
      "norm_f-measure": 0.05555555555555555,
      "printMat_precision": 1.0,
      "printMat_recall": 0.0,
      "printMat_f-measure": 0.0,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.0,
      "supportMat_f-measure": 0.0,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 0.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.25
    },
    "info": {
      "parsableTriplesCount": 8,
      "parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340_> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://purl.org/tema/051993/> .\n<https://data.semper-ki.org/resources/Industry_F340_> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence_> .\n<https://data.semper-ki.org/resources/Industry_F340_> <http://schema.org/height> _:n710b1047d1734437843db1c9fad3b76ab2 .\n_:n710b1047d1734437843db1c9fad3b76ab2 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/M> .\n_:n710b1047d1734437843db1c9fad3b76ab3 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/M> .\n_:n710b1047d1734437843db1c9fad3b76ab1 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/M> .\n<https://data.semper-ki.org/resources/Industry_F340_> <http://schema.org/depth> _:n710b1047d1734437843db1c9fad3b76ab3 .\n<https://data.semper-ki.org/resources/Industry_F340_> <http://schema.org/width> _:n710b1047d1734437843db1c9fad3b76ab1 .\n"
    },
    "duration": "0:00:13.355825",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:42:24.688876",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:42:38.044696",
        " @prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix tema: <http://purl.org/tema/051993/> . \n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix printer: <https://data.semper-ki.org/resources/Industry_F340_>  .  \n@prefix mfg: <https://data.semper-ki.org/resources/3DGence_>  . \n\nprinter: rdf:type tema: ;\n   schema:manufacturer mfg: ;\n   printMaterial   <https://data.semper-ki.org/resources/materials/ABS> ;\n   printMaterial   <https://data.semper-ki.org/resources/materials/ASA> ;\n   printMaterial  <https://data.semper-ki.org/resources/materials/PA> ;\n   printMaterial   <https://data.semper-ki.org/resources/materials/PA_CF> ;\n   printMaterial   <https://data.semper-ki.org/resources/materials/PA_GF> ;\n   printMaterial   <https://data.semper-ki.org/resources/materials/PC> ;\n   printMaterial   <https://data.semper-ki.org/resources/materials/PC_ABS> ;\n   printMaterial   <https://data.semper-ki.org/resources/materials/PC_ESD> ;  \n   printMaterial   <https://data.semper-ki.org/resources/materials/PC_CF> ;\n   printMaterial   <https://data.semper-ki.org/resources/materials/PEEK> ;\n   printMaterial    <https://data.semper-ki.org/resources/materials/PEKK> ; \n   supportMaterial  <https://data.semper-ki.org/resources/materials/ESM_10> ; \n   supportMaterial  <https://data.semper-ki.org/resources/materials/HIPS> ; \n   supportMaterial  <https://data.semper-ki.org/resources/materials/BVOH> ; \n   schema:width [\n      qudt:numericValue \"0.26\"^^xsd:double;\n      qudt:hasUnit <http://qudt.org/vocab/unit/M>\n   ] ;\n   schema:height [\n      qudt:numericValue \"0.30\"^^xsd:double ;\n      qudt:hasUnit <http://qudt.org/vocab/unit/M> \n   ] ;\n   schema:depth [\n     qudt:numericValue \"0.34\"^^xsd:double;\n     qudt:hasUnit <http://qudt.org/vocab/unit/M>\n   ] ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:42:38.370151",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.399405646359584,
      "normDiffRatio": 0.0,
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      "norm_recall": 0.0,
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      "printMat_precision": 1.0,
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      "supportMat_recall": 0.0,
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      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
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      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.0
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    "info": {
      "parsableTriplesCount": 0,
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    "duration": "0:00:08.620914",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:42:38.370158",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:42:46.991065",
        " @prefix 3dg: <https://data.semper-ki.org/resources/> .\n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n\n3dg:Industry_F340 rdf:type <http://purl.org/tema/051993> ;\n    schema:manufacturer 3dg:3DGence ;\n    3dg:printMaterial 3dg:PLA, \n        3dg:ABS, \n        3dg:PA, \n        3dg:ASA, \n        3dg:PP, \n        3dg:TPU ;\n    3dg:supportMaterial 3dg:ESM-10, \n        3dg:HIPS, \n        3dg:BVOH ;\n    schema:width [qudt:QuantityValue qudt:numericValue \"260.0\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ] ;\n    schema:depth [qudt:QuantityValue qudt:numericValue \"300.0\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ] ;\n    schema:height [qudt:QuantityValue qudt:numericValue \"340.0\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ] .\n\n3dg:3DGence rdfs:label \"3DGence\" ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:42:47.229157",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.3283740701381509,
      "normDiffRatio": 0.6115172502244453,
      "norm_precision": 0.2,
      "norm_recall": 0.20689655172413793,
      "norm_f-measure": 0.20338983050847456,
      "printMat_precision": 1.0,
      "printMat_recall": 0.0,
      "printMat_f-measure": 0.0,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.0,
      "supportMat_f-measure": 0.0,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.96875
    },
    "info": {
      "parsableTriplesCount": 31,
      "parsableTriples": "<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/materials/PLA> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Material> .\n<https://data.semper-ki.org/resources/materials/TPU> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Material> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n_:n73ab558ea1a849b48711afc0b2042df6b3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Meter> .\n<https://data.semper-ki.org/resources/materials/PA> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Material> .\n<https://data.semper-ki.org/resources/materials/ASA> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Material> .\n<https://data.semper-ki.org/resources/materials/HIPS> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Material> .\n<https://data.semper-ki.org/resources/materials/BVOH> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Material> .\n<https://data.semper-ki.org/resources/materials/PP> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Material> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n73ab558ea1a849b48711afc0b2042df6b3 .\n<https://data.semper-ki.org/resources/materials/ABS> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Material> .\n<https://data.semper-ki.org/resources/materials/ESM_10> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Material> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/0519933DPrinter> .\n_:n73ab558ea1a849b48711afc0b2042df6b2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Meter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n73ab558ea1a849b48711afc0b2042df6b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n_:n73ab558ea1a849b48711afc0b2042df6b1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Meter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:n73ab558ea1a849b48711afc0b2042df6b2 <http://qudt.org/schema/qudt#numericValue> \"0.8\" .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Organization> .\n_:n73ab558ea1a849b48711afc0b2042df6b1 <http://qudt.org/schema/qudt#numericValue> \"1.2\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n_:n73ab558ea1a849b48711afc0b2042df6b3 <http://qudt.org/schema/qudt#numericValue> \"1.1\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n73ab558ea1a849b48711afc0b2042df6b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM_10> .\n"
    },
    "duration": "0:00:12.185821",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:42:47.229163",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:42:59.414978",
        " @prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#>.\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#>.\n@prefix qudt: <http://qudt.org/schema/qudt#>.  \n@prefix schema: <http://schema.org/>.  \n@prefix tema: <https://purl.org/tema/051993>. \n@prefix data:   <https://data.semper-ki.org/resources/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/>. \n\ndata:Industry_F340 rdf:type tema:3DPrinter;\n    schema:manufacturer data:3DGence;\n    data:printMaterial  materials:ABS , materials:PLA , materials:PA , materials:ASA , materials:PP  , materials:TPU ;\n    data:supportMaterial materials:ESM_10 , materials:HIPS , materials:BVOH;\n    schema:width [qudt:numericValue  \"1.2\"; \n                 qudt:hasUnit <http://qudt.org/vocab/unit#Meter>]; \n    schema:height [qudt:numericValue \"0.8\";\n                 qudt:hasUnit <http://qudt.org/vocab/unit#Meter> ];\n    schema:depth [qudt:numericValue \"1.1\";\n                 qudt:hasUnit <http://qudt.org/vocab/unit#Meter>].\n\ndata:3DGence rdf:type schema:Organization;\n    rdfs:label \"3DGence\". \nmaterials:ABS  rdf:type schema:Material.\nmaterials:PLA  rdf:type schema:Material.  \nmaterials:PA   rdf:type schema:Material.  \nmaterials:ASA rdf:type schema:Material.\nmaterials:PP   rdf:type schema:Material.\nmaterials:TPU rdf:type schema:Material.\nmaterials:ESM_10 rdf:type schema:Material.\nmaterials:HIPS rdf:type schema:Material.\nmaterials:BVOH rdf:type schema:Material.  "
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:42:59.532124",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.22233425762540962,
      "normDiffRatio": 0.6337235821803254,
      "norm_precision": 0.8823529411764706,
      "norm_recall": 0.5172413793103449,
      "norm_f-measure": 0.6521739130434783,
      "printMat_precision": 0.9090909090909091,
      "printMat_recall": 0.7692307692307693,
      "printMat_f-measure": 0.8333333333333333,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.75,
      "supportMat_f-measure": 0.8571428571428571,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.5
    },
    "info": {
      "parsableTriplesCount": 16,
      "parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993/3D_Printer> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n"
    },
    "duration": "0:00:11.625461",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:42:59.532130",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:43:11.157585",
        " @prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#>. \n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#>.\n@prefix tema: <https://purl.org/tema/051993/>.  \n@prefix schema: <http://schema.org/>.\n@prefix qudt: <http://qudt.org/schema/1.3.1#>. \n@prefix res: <https://data.semper-ki.org/resources/>.\n@prefix prop: <https://data.semper-ki.org/properties/>. \n@prefix mat: <https://data.semper-ki.org/resources/materials/>.\n\nres:Industry_F340 rdf:type tema:3D_Printer.\nres:Industry_F340 schema:manufacturer res:3DGence.\nres:Industry_F340 prop:printMaterial mat:ABS;\n                        prop:printMaterial mat:PLA;\n                        prop:printMaterial mat:PA;\n                        prop:printMaterial mat:ASA;\n                        prop:printMaterial mat:PP;\n                        prop:printMaterial mat:PC;\n                        prop:printMaterial mat:PC-ABS;\n                        prop:printMaterial mat:PC-ESD;\n                        prop:printMaterial mat:PC-CF;\n                        prop:printMaterial mat:PEEK;\n                        prop:printMaterial mat:PEKK;. \nres:Industry_F340 prop:supportMaterial mat:ESM-10;\n                         prop:supportMaterial mat:HIPS;\n                         prop:supportMaterial mat:BVOH.\nres:Industry_F340 schema:width [qudt:numericValue \"1100\"^^xsd:double; qudt:hasUnit <https://qudt.org/vocab/unit/Millimeter>].  \nres:Industry_F340 schema:depth [qudt:numericValue \"800\"^^xsd:double; qudt:hasUnit <https://qudt.org/vocab/unit/Millimeter>].\nres:Industry_F340 schema:height [qudt:numericValue \"1200\"^^xsd:double; qudt:hasUnit <https://qudt.org/vocab/unit/Millimeter>]."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:43:11.317233",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.20558526440879382,
      "normDiffRatio": 0.4130901287553648,
      "norm_precision": 0.25,
      "norm_recall": 0.10344827586206896,
      "norm_f-measure": 0.14634146341463414,
      "printMat_precision": 1.0,
      "printMat_recall": 0.0,
      "printMat_f-measure": 0.0,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.0,
      "supportMat_f-measure": 0.0,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.34375
    },
    "info": {
      "parsableTriplesCount": 11,
      "parsableTriples": "<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials:PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/materials:BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/materials:ESM_10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials:ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials:ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials:PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials:PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/materials:HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials:TPU> .\n"
    },
    "duration": "0:00:09.573780",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:43:11.317240",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:43:20.891013",
        " @prefix df: <https://data.semper-ki.org/resources/> .\n@prefix tema: <https://purl.org/tema/> .  \n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#>.          \n@prefix xsd: <http://www.w3.org/2001/XMLSchema#>. \n    \ndf:Industry_F340 rdf:type tema:051993 .\ndf:Industry_F340 schema:manufacturer df:3DGence .\ndf:3DGence rdfs:label \"3DGence\" .\n\ndf:Industry_F340 schema: width [qudt:numericValue \"260\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Metre> ] .\ndf:Industry_F340 schema: height [qudt:numericValue \"300\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Metre> ] .\ndf:Industry_F340 schema: depth [qudt:numericValue \"340\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#MilliMetre> ] .\n\ndf:Industry_F340 schema:printMaterial df:materials:ABS, df:materials:PLA, df:materials:PA, df:materials:ASA, df:materials:PP, df:materials:TPU .\ndf:Industry_F340 df:supportMaterial df:materials:ESM_10, df:materials:HIPS, df:materials:BVOH.     "
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:43:21.076767",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.21320973348783315,
      "normDiffRatio": 0.1613485851896448,
      "norm_precision": 0.18181818181818182,
      "norm_recall": 0.06896551724137931,
      "norm_f-measure": 0.1,
      "printMat_precision": 1.0,
      "printMat_recall": 0.0,
      "printMat_f-measure": 0.0,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.0,
      "supportMat_f-measure": 0.0,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.3125
    },
    "info": {
      "parsableTriplesCount": 10,
      "parsableTriples": "<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/BVOH> <http://www.w3.org/2000/01/rdf-schema#label> \"BVOH\" .\n<https://data.semper-ki.org/resources/PLA> <http://www.w3.org/2000/01/rdf-schema#label> \"PLA\" .\n<https://data.semper-ki.org/resources/ABS> <http://www.w3.org/2000/01/rdf-schema#label> \"ABS\" .\n<https://data.semper-ki.org/resources/ASA> <http://www.w3.org/2000/01/rdf-schema#label> \"ASA\" .\n<https://data.semper-ki.org/resources/PA> <http://www.w3.org/2000/01/rdf-schema#label> \"PA\" .\n<https://data.semper-ki.org/resources/TPU> <http://www.w3.org/2000/01/rdf-schema#label> \"TPU\" .\n<https://data.semper-ki.org/resources/ESM-10> <http://www.w3.org/2000/01/rdf-schema#label> \"ESM-10\" .\n<https://data.semper-ki.org/resources/PP> <http://www.w3.org/2000/01/rdf-schema#label> \"PP\" .\n<https://data.semper-ki.org/resources/HIPS> <http://www.w3.org/2000/01/rdf-schema#label> \"HIPS\" .\n"
    },
    "duration": "0:00:10.516179",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:43:21.076773",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:43:31.592946",
        " @prefix : <https://data.semper-ki.org/resources/> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> . \n@prefix qudt: <http://www.qudt.org/1.1/schema/qudt#> .\n@prefix schema: <http://schema.org/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n\n:Industry_F340 rdf:type <https://purl.org/tema/051993> ;\nschema:manufacturer :3DGence ;\n:printMaterial :ABS , :PLA , :PA , :ASA , :PP ,:TPU ;  \n:supportMaterial :ESM-10 , :HIPS , :BVOH ;\nschema:height [qudt:QuantityValue qudt:numericValue \"1100.0\"^^xsd:double;  \n            qudt:unit <http://qudt.org/1.1/vocab/unit/Meter> ] ;\nschema:width [qudt:QuantityValue qudt:numericValue \"800.0\"^^xsd:double;  \n              qudt:unit <http://qudt.org/1.1/vocab/unit/Meter> ] ;\nschema:depth  [qudt:QuantityValue qudt:numericValue \"1200.0\"^^xsd:double;  \n              qudt:unit <http://qudt.org/1.1/vocab/unit/Meter> ] .\n\n:3DGence rdfs:label \"3DGence\" .\n\n:ABS rdfs:label \"ABS\" . \n:PLA rdfs:label \"PLA\" .\n:PA rdfs:label \"PA\" .\n:ASA rdfs:label \"ASA\" . \n:PP rdfs:label \"PP\" .\n:TPU rdfs:label \"TPU\" .\n:ESM-10 rdfs:label \"ESM-10\" .\n:HIPS rdfs:label \"HIPS\" .\n:BVOH rdfs:label \"BVOH\" ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:43:31.784479",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.36363636363636365,
      "normDiffRatio": 0.7311435523114356,
      "norm_precision": 0.75,
      "norm_recall": 0.5172413793103449,
      "norm_f-measure": 0.6122448979591838,
      "printMat_precision": 1.0,
      "printMat_recall": 0.46153846153846156,
      "printMat_f-measure": 0.631578947368421,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.75,
      "supportMat_f-measure": 0.8571428571428571,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 0.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.71875
    },
    "info": {
      "parsableTriplesCount": 23,
      "parsableTriples": "_:n3e9cbf038ef8471e916a88a0601846b5b1 <http://qudt.org/schema/qudt/QuantityValue> _:n3e9cbf038ef8471e916a88a0601846b5b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n3e9cbf038ef8471e916a88a0601846b5b3 .\n_:n3e9cbf038ef8471e916a88a0601846b5b4 <http://qudt.org/schema/qudt/numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n3e9cbf038ef8471e916a88a0601846b5b4 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n_:n3e9cbf038ef8471e916a88a0601846b5b5 <http://qudt.org/schema/qudt/QuantityValue> _:n3e9cbf038ef8471e916a88a0601846b5b6 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n_:n3e9cbf038ef8471e916a88a0601846b5b2 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n3e9cbf038ef8471e916a88a0601846b5b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:n3e9cbf038ef8471e916a88a0601846b5b3 <http://qudt.org/schema/qudt/QuantityValue> _:n3e9cbf038ef8471e916a88a0601846b5b4 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n_:n3e9cbf038ef8471e916a88a0601846b5b6 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n3e9cbf038ef8471e916a88a0601846b5b5 .\n_:n3e9cbf038ef8471e916a88a0601846b5b2 <http://qudt.org/schema/qudt/numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n_:n3e9cbf038ef8471e916a88a0601846b5b6 <http://qudt.org/schema/qudt/numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n"
    },
    "duration": "0:00:09.775786",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:43:31.784484",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:43:41.560265",
        " @prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix :   <https://data.semper-ki.org/resources/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n@prefix properties: <https://data.semper-ki.org/properties/> .\n\n:Industry_F340 \n    rdf:type <https://purl.org/tema/051993> ;\n    schema:manufacturer :3DGence ; \n    properties:printMaterial materials:PLA, materials:ABS, materials:PA, \n\t    materials:ASA, materials:PP, materials:TPU ;\n    properties:supportMaterial materials:ESM-10, materials:HIPS, materials:BVOH ;\n    schema:width [qudt:QuantityValue [qudt:numericValue \"260\"^^xsd:double; \n\t\t\t\tqudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ]] ;\n    schema:depth  [qudt:QuantityValue [qudt:numericValue \"300\"^^xsd:double;  \n        \t\tqudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ]] ;\n    schema:height  [qudt:QuantityValue [qudt:numericValue \"340\"^^xsd:double;  \n    \t\tqudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ]]  .\n\n:3DGence \n    rdfs:label \"3DGence\"@en ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:43:41.727178",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.1827309236947791,
      "normDiffRatio": 0.0,
      "norm_precision": 1.0,
      "norm_recall": 0.0,
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      "printMat_precision": 1.0,
      "printMat_recall": 0.0,
      "printMat_f-measure": 0.0,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.0,
      "supportMat_f-measure": 0.0,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.0
    },
    "info": {
      "parsableTriplesCount": 0,
      "parsableTriples": ""
    },
    "duration": "0:00:13.951788",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:43:41.727183",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:43:55.678966",
        " @prefix : <https://data.semper-ki.org/resources/> .\n@prefix schema: <http://schema.org/> . \n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix printM: <https://data.semper-ki.org/properties/printMaterial> .\n@prefix supM: <https://data.semper-ki.org/properties/supportMaterial> .\n@prefix tema: <https://purl.org/tema/051993> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .                   \n\n:Industry_F340 \n    rdf:type tema:3DPrinter ;\n    schema:manufacturer :3DGence ;\n    printM: PLA, ABS, PA, ASA, PP, TPU ;\n    supM: ESM-10, HIPS, BVOH ;\n    schema:height  [qudt:numericValue \"1100.0\"^^xsd:double; \n                      qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ],\n                   schema:width [qudt:numericValue \"1200.0\"^^xsd:double; \n                       qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>], \n                   schema:depth [qudt:numericValue \"800.0\"^^xsd:double;  \n                       qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>] . \n \n:3DGence rdfs:label \"3DGence\" . \n:ABSBVOH  rdf:type <https://data.semper-ki.org/resources/materials/ABS> .\n:ESM-10 rdf:type <https://data.semper-ki.org/resources/materials/ESM-10> .\n:HIPS rdf:type <https://data.semper-ki.org/resources/materials/HIPS> .  \n:PLA rdf:type <https://data.semper-ki.org/resources/materials/PLA> . \n:PA rdf:type <https://data.semper-ki.org/resources/materials/PA> .\n:ASA rdf:type <https://data.semper-ki.org/resources/materials/ASA> .\n:PP rdf:type <https://data.semper-ki.org/resources/materials/PP> .  \n:TPU rdf:type <https://data.semper-ki.org/resources/materials/TPU> ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:43:56.033052",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.2396864686468647,
      "normDiffRatio": 0.4730815245257221,
      "norm_precision": 1.0,
      "norm_recall": 0.4482758620689655,
      "norm_f-measure": 0.6190476190476191,
      "printMat_precision": 1.0,
      "printMat_recall": 0.46153846153846156,
      "printMat_f-measure": 0.631578947368421,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.75,
      "supportMat_f-measure": 0.8571428571428571,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.375
    },
    "info": {
      "parsableTriplesCount": 12,
      "parsableTriples": "<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n"
    },
    "duration": "0:00:17.237795",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:43:56.033058",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:44:13.270847",
        " @prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> . \n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix tema: <https://purl.org/tema/> .\n\n<https://data.semper-ki.org/resources/Industry_F340> rdf:type tema:051993 .\n<https://data.semper-ki.org/resources/Industry_F340> schema:manufacturer <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/3DGence> rdfs:label \"3DGence\" . \n\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS>. \n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA>.\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA>.\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA>.\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP>.\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU>.\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10>.\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS>. \n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH>.\n\n<https://data.semper-ki.org/resources/Industry_F340> schema:width [qudt:numericValue \"1200\"^^xsd:double; \n                 qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ].\n<https://data.semper-ki.org/resources/Industry_F340> schema:depth [qudt:numericValue \"800\"^^xsd:double;   \n                 qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ].  \n<https://data.semper-ki.org/resources/Industry_F340> schema:height [qudt:numericValue \"1100\"^^xsd:double;   \n                 qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ] ."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:44:13.530959",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.24528301886792453,
      "normDiffRatio": 0.6363636363636364,
      "norm_precision": 0.21052631578947367,
      "norm_recall": 0.13793103448275862,
      "norm_f-measure": 0.16666666666666666,
      "printMat_precision": 1.0,
      "printMat_recall": 0.0,
      "printMat_f-measure": 0.0,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.0,
      "supportMat_f-measure": 0.0,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.5625
    },
    "info": {
      "parsableTriplesCount": 18,
      "parsableTriples": "<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/SM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PEEK> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PC-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/supportMaterial> <https://data.semper-ki.org/resources/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/resources/printMaterial> <https://data.semper-ki.org/resources/PC> .\n"
    },
    "duration": "0:00:11.130871",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:44:13.530964",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:44:24.661830",
        " @prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#>.\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#>.\n@prefix schema: <http://schema.org/>.  \n@prefix qudt: <http://qudt.org/schema/qudt#>.\n@prefix : <https://data.semper-ki.org/resources/>.\n\n:Industry_F340 rdf:type <https://purl.org/tema/051993>.\n:Industry_F340 schema:manufacturer :3DGence.\n:3DGence rdfs:label \"3DGence\".\n:Industry_F340 :printMaterial  :ABS. \n:Industry_F340 :printMaterial  :PLA.\n:Industry_F340 :printMaterial  :PA.\n:Industry_F340 :printMaterial  :ASA.\n:Industry_F340 :printMaterial  :PP.\n:Industry_F340 :printMaterial  :TPU.\n:Industry_F340 :printMaterial  :PC.  \n:Industry_F340 :printMaterial  :PC-ABS.\n:Industry_F340 :printMaterial  :PC-ESD.\n:Industry_F340 :printMaterial  :PC-CF.\n:Industry_F340 :printMaterial  :PEEK.\n:Industry_F340 :printMaterial   :PEKK.\n:Industry_F340 :supportMaterial   :SM-10.\n:Industry_F340 :supportMaterial   :HIPS. \n:Industry_F340 :supportMaterial   :BVOH. \n:Industry_F340 schema:width  [qudt:numericValue  \"260.0\"^^xsd:double; qudt:hasUnit  qudt:MILLIMETRE].   \n:Industry_F340 schema:depth   [qudt:numericValue  \"300.0\"^^xsd:double; qudt:hasUnit  qudt:MILLIMETRE].\n:Industry_F340 schema:height  [qudt:numericValue  \"340.0\"^^xsd:double; qudt:hasUnit  qudt:MILLIMETRE]."
      ]
    ]
  },
  {
    "startTime": "2023-07-03T12:44:24.826860",
    "modelId": "Claude--claude-1.3-100k--claude-1.3-100k",
    "taskInfo": {
      "taskId": "FactExtractStatic",
      "version": "1.0",
      "gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
    },
    "scores": {
      "diffRatioRaw": 0.38635112823335166,
      "normDiffRatio": 0.7719830200121286,
      "norm_precision": 0.8,
      "norm_recall": 0.5517241379310345,
      "norm_f-measure": 0.6530612244897959,
      "printMat_precision": 1.0,
      "printMat_recall": 0.46153846153846156,
      "printMat_f-measure": 0.631578947368421,
      "supportMat_precision": 1.0,
      "supportMat_recall": 0.75,
      "supportMat_f-measure": 0.8571428571428571,
      "DimValues_precision": 1.0,
      "DimValues_recall": 0.0,
      "DimValues_f-measure": 0.0,
      "DimUnit_precision": 1.0,
      "DimUnit_recall": 0.0,
      "DimUnit_f-measure": 0.0,
      "parsableTripleRatio": 0.65625
    },
    "info": {
      "parsableTriplesCount": 21,
      "parsableTriples": "<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:na4da4fdb771241e5a8ddf0fed9f9b514b1 <http://qudt.org/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:na4da4fdb771241e5a8ddf0fed9f9b514b1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:na4da4fdb771241e5a8ddf0fed9f9b514b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n_:na4da4fdb771241e5a8ddf0fed9f9b514b2 <http://qudt.org/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:na4da4fdb771241e5a8ddf0fed9f9b514b2 .\n_:na4da4fdb771241e5a8ddf0fed9f9b514b3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:na4da4fdb771241e5a8ddf0fed9f9b514b3 <http://qudt.org/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:na4da4fdb771241e5a8ddf0fed9f9b514b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n_:na4da4fdb771241e5a8ddf0fed9f9b514b2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n"
    },
    "duration": "0:00:10.571151",
    "interactions": [
      [
        "prompt",
        "2023-07-03T12:44:24.826865",
        "As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$  label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial  respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name:   Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology:  FFF Working temperature:  15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature:  0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements:  230V AC\nChamber temperature:  85\u00b0C (active heating) Max power draw:  2700 W\nFilament chamber temperature:  70\u00b0C Communication:  USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions:  1200 \u00d7 800 \u00d7 1100 mm Slicing software:  3DGence SLICER 4.0\nMass:  200 kg\nSAFETY\nCONSTRUCTION\nFiltration:  filtration unit\nChassis:   powder coated steel  UPS device:  yes, optional\nBuild surface: heated ceramic plate Others:  software access overdrive - remote \nPositioning resolution XY:  0.006 mm shut down\nPositioning resolution Z:  0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n    "
      ],
      [
        "response",
        "2023-07-03T12:44:35.398011",
        " Here is the Knowledge Graph in RDF Turtle format:\n\n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix owl: <http://www.w3.org/2002/07/owl#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix tema: <https://purl.org/tema/> .\n@prefix schema: <http://schema.org/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\n<https://data.semper-ki.org/resources/Industry_F340> rdf:type tema:051993 ;\n     schema:manufacturer <https://data.semper-ki.org/resources/3DGence> ;\n     <https://data.semper-ki.org/properties/printMaterial> materials:ABS, materials:PLA, materials:PA, \n     materials:ASA, materials:PP, materials:TPU ;\n     <https://data.semper-ki.org/properties/supportMaterial> materials:ESM-10, materials:HIPS, \n     materials:BVOH ;\n     schema:width  [qudt:numericValue \"260.0\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ] ;\n     schema:depth  [qudt:numericValue \"300.0\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ] ;\n     schema:height [qudt:numericValue \"340.0\"^^xsd:double; qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ] .\n\n<https://data.semper-ki.org/resources/3DGence> rdfs:label \"3DGence\" ."
      ]
    ]
  }
]